94V

Overview

Basic Info.

Model NO.	Flex PCB
Processing Technology	Electrolytic Foil
Base Material	Copper
Insulation Materials	Organic Resin
Transport Package	by Vacuum Packing in Cartons
Trademark	KMC
Origin	Shenzhen, Guangdong
HS Code	85340090
Production Capacity	5000000pieces/Year

Product Description

Product Detail

Basic Info

• Type: FPC
• Dielectric: PI
• Insulation Materials: LPI white solder mask or Coverlay
• Min. Hole Size: 0.2mm
• Min. Line Width&Spacing: 0.1mm/0.1mm
• Certificates: UL, RoHS, SGS, ISO9001 ISO14000
• Shipping: DHL, UPS, TNT, FedEx, etc
• Soldermask: Green,Blue,White,Black,Yellow,Red
• Silkscreen: White,Black
• Origin: Shengzhen

Company Profile

Customer Question & Answer

NO.	Item		Production Capacity
1	Layer Counts		1--6
2	Panel Size		Maximum	400mm×650mm
	Base Material Type		Polyimide (PI) Thickness(µm)	12.5, 25, 50, 75, 125
3			Polyester(PET) Thickness(µm)	25, 50, 75, 100, 125
4	Base Copper Thickness		ED &RA (Rolled Annealed)(μm)	18, 35, 70
	Coverlay Thickness		Polyimide (PI) (μm)	12.5, 25, 50, 75, 125
5			Polyester (PET) (μm)	25, 50
6	Adhesive Thickness		12.5, 25, 50 um
7	Stiffener Type		Polyimide (PI);Polyester (PET);FR-4 ;Aluminium foil
8	Minimum Hole Size		0.2mm
9	Minimum Slot hole		0.6mm×0.8mm
10	Minimum Trace Width/Space		0.05mm/0.05mm
11	Minimum Annular Ring Width		0.05
12	Minimum Outline Tolerance		±0.05mm
13	Minimum SMT Pitch		0.40mm
14	Insulation Resistance		1011Ω
15	Peel off Shock Resistance		1.0N/mm
16	Thermal shock Resistance		260ºC 10sec 3times
17	Surface Treatment Type		HASL;HASL+Lead Free;Immersion Gold;Immersion Tin;
			Flash Gold;OSP;Immersion Silver;Gold Finger
18	E-test		Volatage:24V--300V;Continuity:5--100MΩ;Flying Probe Tester ;AOI

Certifications

Detailed Photos